30 khz-30 ghz gaas mmic optical modulator driver amplifier page 1 of 4 mimix broadband, inc., 10795 rockley rd., houston, texas 77099 tel: 281.988.4600 fax: 281.988.4615 mimixbroadband.com characteristic data and specifications are subject to change without notice. ? 2006 mimix broadband, inc. export of this item may require appropriate export licensing from the u.s. government. in purchasing these parts, u.s. domestic customers accept their obligation to be compliant with u.s. export laws. cmm3030-bd august 2006 - rev 02-aug-06 features small size high gain: 9 db typical output voltage up to 7.5 v peak-to-peak 30 khz to 30 ghz bandwidth low gain ripple: 1.0 db pp typical sub 0.25 micron phemt applications driver amplifier for linb0 3 modulator @ oc192 bit rate sonet/shd transmission systems medium power linear gain block for broadband systems description the cmm3030-bd is a precision gaas mmic, medium power amplifier and is part of celeritek?s family of widefiber? products. the cmm3030-bd optical driver amplifier gives fiber optic system designers a unique combination of wide- band frequency coverage, along with a flat response and very low internal jitter. it is a precision phemt gaas mmic medium power amplifier with +23 dbm @ p1db. it operates from 30 khz to 30 ghz with a 9 db linear gain. low internal jitter makes it especially well suited for high speed digital data applications. maximum output voltage is 7.5 v peak-to- peak. it is an excellent choice as a driver amplifier for lithium niobate (mach-zehnder) external optical modulators, to achieve high extinction ratio. targeted for oc-192/stm64 metropolitan and long-haul dense wave-division multiplexed optical networking applications and other high speed applica- tions. the bit rate can be as high as 15 gb/s to provide over- head for forward error-correction algorithms. the bias voltage can be adjusted to reduce the output voltage as needed. cmm3030-bd amplifiers are shipped in gel pack from celeritek?s foundry. chip diagram specifications (t a = 25c, v dd = 8v) (on-wafer probe) x a m p y t n i m s t i n u s r e t e m a r a p z h g 0 . 0 3 z h k 0 3 ? e g n a r y c n e u q e r f 0 . 9 0 . 8 b d n i a g l a n g i s l l a m s 5 7 . 0 5 . 0 b d s s e n t a l f n i a g 1 : 0 . 2 1 : 8 . 1 ? r w s v t u p t u o / t u p n i power output (@1 db gain compression) @ 12 ghz dbm 22.0 24.0 second order intercept point @ 12 ghz dbm 40.0 third order intercept point @ 12 ghz dbm 30.0 0 5 3 5 7 2 a m t n e r r u c units in microns
30 khz-30 ghz gaas mmic optical modulator driver amplifier page 2 of 4 mimix broadband, inc., 10795 rockley rd., houston, texas 77099 tel: 281.988.4600 fax: 281.988.4615 mimixbroadband.com characteristic data and specifications are subject to change without notice. ? 2006 mimix broadband, inc. export of this item may require appropriate export licensing from the u.s. government. in purchasing these parts, u.s. domestic customers accept their obligation to be compliant with u.s. export laws. cmm3030-bd august 2006 - rev 02-aug-06 absolute maximum ratings g n i t a r r e t e m a r a p v 2 1 e g a t l o v n i a r d v 5 - e g a t l o v e t a g a m 5 7 3 t n e r r u c n i a r d continuous power dissipation 3.0 w channel temperature +175c storage temperature -65c to +175c mounting temperature +320c m b d 3 2 + r e w o p t u p n i die attach and bonding procedures die attach: eutectic die attach is recommended. for eutec- tic die attach: preform: ausn (80% au, 20% sn); stage temperature: 290c, 5c; handling tool: tweezers; time: 1 min or less. wire bonding: wire size: 0.7 to 1.0 mil in diameter (pre- stressed); thermocompression bonding is preferred over thermosonic bonding. for thermocompression bonding: stage temperature: 250c; bond tip temperature: 150c; bonding tip pressure: 18 to 40 gms depending on size of wire. performance optimization using the gain-ctl facility of the cmm3030-bd, out- put power may be increased by application of 1.2 to 1.8 volts to the bias control pad. if the gain-ctl facility is not used, a fixed voltage at the bias control pad can be implemented by connecting a off-chip parallel resistor to the pad which will lower the output voltage accordingly. if bias control voltage is decreased further than those lowest values given in the tables, both gain and output power will start to drop. typical performance p1db vs temperature
30 khz-30 ghz gaas mmic optical modulator driver amplifier page 3 of 4 mimix broadband, inc., 10795 rockley rd., houston, texas 77099 tel: 281.988.4600 fax: 281.988.4615 mimixbroadband.com characteristic data and specifications are subject to change without notice. ? 2006 mimix broadband, inc. export of this item may require appropriate export licensing from the u.s. government. in purchasing these parts, u.s. domestic customers accept their obligation to be compliant with u.s. export laws. cmm3030-bd august 2006 - rev 02-aug-06 typical performance schematic diagram
30 khz-30 ghz gaas mmic optical modulator driver amplifier page 4 of 4 mimix broadband, inc., 10795 rockley rd., houston, texas 77099 tel: 281.988.4600 fax: 281.988.4615 mimixbroadband.com characteristic data and specifications are subject to change without notice. ? 2006 mimix broadband, inc. export of this item may require appropriate export licensing from the u.s. government. in purchasing these parts, u.s. domestic customers accept their obligation to be compliant with u.s. export laws. cmm3030-bd august 2006 - rev 02-aug-06 ordering information part number for ordering description r e i f i l p m a r e v i r d r o t a l u d o m l a c i t p o d b - 0 3 0 3 m m c bonding sample mmic termination circuit design
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